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Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper

Shenzhen Tunsing Plastic Products Co., Ltd.
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    Buy cheap Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper from wholesalers
     
    Buy cheap Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper from wholesalers
    • Buy cheap Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper from wholesalers
    • Buy cheap Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper from wholesalers
    • Buy cheap Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper from wholesalers
    • Buy cheap Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper from wholesalers
    • Buy cheap Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper from wholesalers

    Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper

    Ask Lasest Price
    Brand Name : Tunsing
    Model Number : DS0022
    Certification : Rohs, REACH
    Price : 0.99-5.99 $/Yard
    Payment Terms : T/T, Paypal
    Supply Ability : 3000000 yards per month
    Delivery Time : 3-5 days
    • Product Details
    • Company Profile

    Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper

    White Transparent Polyamide Hot Melt Adhesive Film for 3C Electronics


    DS0022 is a thermoplastic film modified hot melt adhesive with the release paper, can be repeatedly heated and plasticized for bonding.This kind of hot melt adhesive has a wide range of adhesive properties, including textile fabrics (cotton, nylon, polyester, acrylic, acrylic), thermosetting materials (epoxy resin, phenolic resin), PVC, ABS, PC, PI, PU, metal, leather, glass fiber and composite materials.Moreover, it has broad activation temperature and moisture resistance, and is insoluble in ketone solvents.

    PA Hot Melt Adhesive Film Physical Characteristics

    Colour

    White transparent

    Conventional Thickness

    0.055mm

    Width Range

    5mm-620mm

    Melting Range

    90-115℃

    Melt Flow Index

    20±10g/10min

    Activation Temperature

    110-170℃

    Proportion

    1.2±0.02g/cm³

    Mechanical Mold Temperature

    130℃-190℃

    Time

    5-15 seconds

    Pressure

    0.3-0.6mpa


    Advantages of PA Hot Melt Adhesive Films:


    . Excellent Adhesion:


    PA hot melt adhesive films exhibit excellent adhesion to a wide range of substrates, including metals, plastics, paper, and textiles.
    The strong adhesive properties ensure a secure bond that can withstand various environmental conditions.


    . Thermal Resistance:


    PA hot melt adhesive films possess good thermal resistance, allowing them to withstand high temperatures without compromising bond strength or integrity.
    This makes them suitable for applications where the bonded assembly may be exposed to elevated temperatures, such as in automotive, electronics, and industrial equipment.


    . Chemical Resistance:


    PA hot melt adhesive films offer good resistance to various chemicals, solvents, and oils, making them suitable for applications where the bond may be exposed to harsh environments or chemical substances.


    Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper

    The Application of DS0022 PA Hot Melt Adehsive Film

    DS0022 is applied to 3C electronics, 5G, automobile, precision instrument, medical treatment, luggage and sports goods.


    . Automotive
    Interior Components: Used for bonding parts like headliners, door panels, and seat covers, providing strong adhesion and flexibility.
    Exterior Bonding: Suitable for attaching trims, emblems, and other exterior components, enhancing durability and aesthetics.


    .Textiles and Apparel
    Interlining and Reinforcement: Commonly used to bond interlining materials to fabrics, providing structure and support in garments.
    Seam Sealing: Employed to seal seams and edges in clothing, preventing fraying and enhancing durability.
    Trim and Label Attachment: Used for attaching decorative trims and labels securely to textile products.


    . Electronics
    Component Bonding: Ideal for bonding components in electronic devices, ensuring secure attachment and protection from moisture.
    Encapsulation: Used to encapsulate sensitive electronic parts, providing insulation and environmental protection.


    Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper


    The advantages of using hot melt adhesive film


    1. Clean;
    2. Eco-friendly;
    3. High efficiency. The fast bonding speed could make the process done in several seconds.
    4. Safety. This product is non-solvent and it could not make any hidden trouble in production;
    5. Hot melt adhesive film has good fastness performance than other glue which could be widely used to laminate many materials;
    6. Automatic production can be realized.
    7. Portable and easily operated.
    8. Reusable. The hot melt adhesive film used for the first time can be heated up and spun off for the second time usage by heating and melting again.
    9. Functional features. The hot melt adhesive is good at dry cleaning, washable, low-temperature resistance, high-temperature resistance and other kinds of good features;
    10. Can be used as both adhesives and sealants;


    Hot Melt Adhesive Film Packing


    Packing: 100 yard in roll

    Shipping: 5-7 days by Express

    Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper


    Company Profile


    Shenzhen Tunsing Plastic Products Co.,Ltd. was established in 2007 and is located in the forefront of technology in Shenzhen City, China, covering an area of 10,000 square meters.

    Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper

    It has a professional polymer technology team led by Master and PhD engineering. Our company specializes in R&D, production and sales of various modified hot melt adhesives, hot melt adhesive film,hot melt adhesive powder, functional film coating, ultra-fine cryogenic powder grinding and die-cutting products.

    Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper


    Certification

    Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper


    FAQ

    1. Do you accept OEM or ODM?

    Yes ,we accept OEM and ODM, we are professional in heat transfer material manufacturer ,accumulated experience in R&D and manufacturing.


    2. May I have your samples?

    Yes, the sample width is 30cm, length is 1-3 yards.


    3. How long is the delivery time?

    a.For sample 3-5 days

    b.For bulk order 3-10 days (depends on order quantity)


    4. What is your payment method?

    We accept T/T, Paypal. You can also pay through Alibaba Trade Assurance.


    5.What services can we provide?

    Accepted Delivery Terms: FOB, CFR, CIF, EXW,Express Delivery;

    Accepted Payment Currency: USD, HKD, CNY;

    Accepted Payment Type: T/T,L/C,D/P D/A,Credit Card,PayPal,Western Union,Cash;

    Language Spoken:English,Chinese,Spanish,Japanese,Portuguese,German,Arabic,French,Russian,Korean,Hindi,Italian

    Quality Transparent Polyamide Hot Melt Film For 3C Electronics With Glassine Release Paper for sale
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